Cadence Allegro Package Designer Named as One of EDN's Hot 100 Products of 2004
SAN JOSE, Calif.—(BUSINESS WIRE)—Feb. 8, 2005—
Cadence Design Systems, Inc. (NYSE:CDN) (Nasdaq:CDN)
today announced that its Cadence(R) Allegro(R) Package Designer was
selected as one of EDN Magazine's Hot 100 Products of 2004. Allegro
Package Designer is the industry's first solution for IC/package
co-design allowing the IC I/O pad ring to be design-optimized in real
time to meet substrate requirements.
The Cadence Allegro system interconnect design platform is a
recognized leader in the silicon-package-board design market. The
Allegro Package Designer environment for design and analysis of
high-density IC packages moves chip/package co-design and analysis to
a new level. Allegro Package Designer combines the industry's leading
package design software with new chip-level I/O feasibility and
planning capabilities.
"Although how innovative or 'hot' a product is never ensures
market success, these products are the 100 we think are the most
promising toward that end among the thousands that vendors introduced
in 2004," said EDN Editor-in-Chief John Dodge.
As digital ICs commonly approach and exceed 1,000 I/Os, the
complexity, time, and cost to implement an efficient IC package
skyrockets. Enabling co-design between the digital IC and IC package
design teams provides them the ability to minimize package costs and
optimize package performance without increasing design team size or
design cycle time.
"We are extremely happy to be named to EDN's prestigious Hot 100
Products of 2004," said Charlie Giorgetti, corporate vice president
and general manager of the silicon-package-board business unit at
Cadence. "Allegro Package Designer combines the typically isolated IC
task of I/O pad ring design/optimization with IC package substrate
design in a concurrent co-design environment that allows both to be
optimized for highest performance with minimized cost."
About Cadence
Cadence is the world's largest supplier of electronic design
technologies and engineering services. Cadence products and services
are used to accelerate and manage the design of semiconductors,
computer systems, networking equipment, telecommunications equipment,
consumer electronics, and other electronics based products. With
approximately 4,900 employees and 2004 revenues of approximately $1.2
billion, Cadence has sales offices, design centers, and research
facilities around the world. The company is headquartered in San Jose,
Calif., and trades on both the New York Stock Exchange and Nasdaq
under the symbol CDN. More information is available at
www.cadence.com.
Cadence, the Cadence logo, and Allegro are registered trademarks
of Cadence Design Systems in the United States and other countries.
All other trademarks are the property of their respective owners.
Contact:
Cadence Design Systems, Inc.
Judy Erkanat, 408-894-2302
jerkanat@cadence.com
